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 Model RFP-050100-1X50-2 Chip Terminations
5 Watts, 50
Chip Terminations
General Specifications
Resistive Element: Substrate: Terminals: Thick film Beryllium oxide ceramic Thick film silver
Electrical Specifications Features
* DC - 6.0 GHz * 5 Watts * BeO Ceramic * Non-Nichrome Resistive Element * Low VSWR * 100% Tested
Resistance Value: Frequency Range: Power: V.S.W.R.: 50 ohms, 2% DC - 6.0 GHz 5 Watts 1.25:1
Notes: Tolerance is .010, unless otherwise specified. Operating temperature is -55C to +150C (see chart). Designed to meet or exceed applicable portions of MIL-E-5400. All dimensions are in inches. Specifications subject to change without notice.
Outline Drawing
SIDE VIEW .050 .010 TOP VIEW
.100
.050
.020
HATCHED AREA INDICATES LOCATION OF PROTECTIVE COATING
VER. 12/5/01
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
1
Model RFP-050100-1X50-2
% OF RATED POWER
Chip Terminations
2
Typical Performance
Power Derating
Suggested Mounting Procedures
.025 MIN. (2 PLACES)
100 75 50 25 0 25 50 75 100 125 150
BOARD LOWER THAN LEAD. BOARD EVEN WITH LEAD. BOARD LOWER THAN LEAD. BOARD HIGHER THAN LEAD.
SUGGESTED STRESS RELIEF METHODS SCALE:
NOT RECOMMENDED APPLICATION SCALE:
1. Make sure that the devices are mounted on flat surfaces (.001" under the device) to optimize the heat transfer. 2. Position device on mounting surface and solder in place using an indalloy type or a 60/40 type solder. 3. Solder leads in place using a 60/40 type solder with a controlled temperature iron (700F).
P.C.B. SOLDER INTERFACE TEMPERATURE -- C
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369


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